Imaging the mechanical properties of nanowire arrays

Dimensional and contact resonance (CR) images of nanowire (NW) arrays are measured using our new-developed CR imaging (CRI) setup. Then a reference method is employed to calculate the indentation modulus of NWs (Mi,NW) representing the elasticity of NWs, by measuring NW arrays (NWAs) and reference samples at the same static probing force. Furthermore, topography is imaged in combination with CR and Mi,NW separately by software, whereby the relation between both parameters of NWAs is visualized. As typical examples, 3D imaging of topography and Mi,NW is performed with Si<111> pillar, Cu and ZnO NWAs. The novel method allows for fast mechanical performance measurements of large-scale vertically-aligned NW arrays (NWAs) without releasing them from their substrates.